(ball grid array, 球状矩阵排列)
网络 球栅阵列(Ball Grid Array);球栅阵列封装;闸球阵列封装
The electroplating techniques in BGA packaging were briefly introduced.
简要介绍了BGA型封装中的电镀技术。
This technique has been successfully applied in BGA chip leads 3-d measurement.
此技术已成功地应用于BGA芯片管脚的三维测量。
In large scale integrated chip field, the IC of BGA encapsulation was widely used.
在大规模集成芯片中以BGA(球栅阵列)封装的IC芯片被广泛使用。
We provide the welding tools, repair tools, fume extraction and BGA repair center.
我们提供的产品主要分焊接工具,返修工具,空气净化系统和BGA专用返修站。
Hands tin stove, electric cutting machine, BGA reworking station, assembly equipment.
手浸锡炉,电动切脚机,BGA返修站和元件成型设备一批。