导电胶

Conductive mechanism, components, and aging properties are key elements for the using of ECA.

导电机理 、 组成及老化性能的研究成为导电胶实用化的关键因素。

The shear strength of COG and COF bonded with ACF is studied by impact test.

采用冲击试验方法研究了各向异性导电胶膜（ACF） 互连的玻璃和柔性基板上倒装芯片（COG和COF）的剪切结合强度。

Then use the spray head on the back of the label material conductive adhesive spraying.

然后搁置喷胶脚向标签背材的背背喷涂导电胶黏剂。

Main factors which affect conductivity and natural aging resistance are formula. Technology and Cu powder size.

影响铜粉导电胶导电性能和自然老化性能的主要因素是胶的配方和工艺条件，铜粉粒度。

Silver - epoxy adhesive , as one kind of green and environmental protective interconnected materials, is widely electronic industry.

银导电胶作为一种新兴的绿色、环保微电子封装互联材料， 其应用日益广泛。