锡膏

Use only with production equipment specifically designed for use with solder paste.

于专为锡膏设计的设备中使用。

Is the average and range of Solder Paste height measurements SPC controlled?

锡膏厚度测量的平均值和间距SPC是否受控？

Screen printing equipment is the key of quality control during printing course.

在锡膏印刷过程中，印刷机是印刷品质控制的关键。

The most obvious is the necessity for increased reflow temperature.

最明显的是，使用无铅锡膏必须提高回流焊温度。

So it will result in rigidity skin u0026 block and solder balls etc.

产生的后果是：锡膏出现硬皮 、 硬块、难熔并产生大量锡球等。