waterjet

The impact force and pressure are described about the pre-mixed abrasive waterjet.

介绍了前混合磨料清砂的冲击力和冲击压强。

Waterjet on glass drilling, glass will break due to the water pressure problem, how to solve this problem.

水刀切割在普通玻璃上打孔，由于水压问题会把玻璃打碎，如何解决这个问题呢。

The introduction to the structure and functions of the control system for high-pressure waterjet descaling is made.

文章介绍了高压水除鳞控制系统的结构与功能。

After an analysis of the process of semiconductor fabrication, a proposal of the wafer dicing using micro-abrasive waterjet is put forward.

通过对半导体加工工艺的分析研究，提出了用磨料水射流切割半导体材料，包括晶圆的切割、芯片的终端封装切割。

SUN Xudong. Research on Key Technologies of a High Pressure Waterjet Cutting System [d]. Wuhan: Huazhong University of Science and Technology, 2013.

[10]孙旭东。高压水射流切割系统关键技术研究[d]。武汉：华中科技大学，2013。